Kövess minket
Mini PC EU
+36 20 4489 581
Contact

  • Shop
  • Products
    • bedrock-r7000
    • Bedrock R7000 Edge AI
    • SolidRun Bedrock V3000
    • Tensor I22
  • Get Quote
  • News
  • About us
    • About us
    • Services
    • Impressum
    • Terms
    • Privacy Policy
  • 0
  • 0
  • Sign in
Contact
  • Description
  • Specification
  • Gallery
  • Get quote

Bedrock PC – a Solid Foundation for the Edge

Bedrock V3000 Basic is a compact high-performance fanless industrial PC based on AMD Ryzen™ Embedded V3000 Processor, designed for demanding applications in harsh environments.

Solid Performance

Bedrock V3000 Basic is powered by AMD Ryzen™ Embedded V3C48 Processor, a state-of-the-art 6nm 8C/16T CPU with industry leading performance and power efficiency. Bedrock PC is utilizing the full capabilities of the processor, including 20 lanes of PCIe Gen4 to allow storage, networking and I/O to keep pace with the CPU. The result is unprecedented performance for a compact fanless IPC.

Packed Solid with Features

The memory, storage and networking devices found in Bedrock V3000 Basic stand out in both performance and capacity. 64 GB DDR5 with ECC, 3x NVME Gen4 2280, 2x 10 GbE SFP+ copper/fiber + 4x 2.5 GbE ports, WiFi 6E, 5G modem with dual SIM and 4 USB ports. All these features are tightly packed in a fanless enclosure of under 1 liter.

Remarkable Fanless Cooling

Hot chips require innovative cooling. Bedrock was designed from the ground up for effective fanless cooling. The CPU is thermally coupled to the chassis using liquid metal TIM to reduce thermal resistance. Stacked heatpipes distribute the heat evenly 360º around the all-aluminum chassis. To optimize convective heat transfer, each chassis wall has two heat exchange layers – aluminum air-ducts that stimulate airflow by chimney effect, and another layer of conventional cooling ribs. As a result, Bedrock can dissipate over 3 times the power of fanless computers of similar size. 

Cooling secondary heat sources

Cooling the secondary heat sources is a key requirement for reliable 24/7 operation under extreme storage or networking utilization profiles. All power dissipating devices inside Bedrock V3000 Basic are thermally coupled to the chassis, including the 3 NVMe, both SODIMMs, power FETs, NICs, SFP+ cages, WiFi adapter and 5G modem.​

Rock Solid Reliability

Bedrock is designed with reliability in mind based on decades of experience in development of IPCs and embedded systems.

  • DC power is through a terminal block with screw locking and has a wide voltage range of 12V – 60V with two stages of regulation.
  • RAM supports ECC.
  • NVMe with power-loss-protection (PLP) can be ordered.
  • Bedrock has redundant SPI Flash to prevent bricking by BIOS corruption as well as WDT and TPM.
  • The enclosure is extremely ruggedized – all-aluminum, fanless and ventless dust-resistant IP40.


Innovative Modular Design


Bedrock is designed to address the diversity of requirements in the IoT space. This is achieved by partitioning the hardware into the following boards:

  • SoM with the CPU, DDR5 and NVMe slots and all native interfaces on 380 pins of high density connectors.
  • Networking and I/O board (NIO) with NICs and ports.
  • Storage and Extension Cards board (SX) with slots for WiFi, 5G modem and extra NVMe devices.
  • Power Module (PM) with DC to DC converter and DC input connector.

This modular design enables agile customization of Bedrock for addressing specific requirements. SolidRun is developing multiple NIO, SX and PM boards that can be mixed and matched as an off-the-shelf solution and also offers development of custom boards as an ODM service. Customers and 3rd parties that are interested in developing custom NIO, SX or PM boards are welcome to contact SolidRun for support.

Bedrock enclosure is designed with customization in mind. Modification of I/O, power input, antenna openings etc. can be performed cost effectively even in small volume.
​


Painless integration

The compact footprint of Bedrock, robust structure, effective fanless cooling and DC input tolerance simplify Bedrock integration. All Bedrock I/O is brought to the front panel, with DC input and antennas in the top panel. The bottom and rear panel are both reserved for mounting, allowing full usability while Bedrock is mounted to a wall or to a desk.
SolidRun offers multiple types of mounting brackets, including lever-based DIN-Rail bracket with locking, wall mount, small stand and ruggedized stand.

Field usability

As a fanless, ventless IPC Bedrock requires no maintenance. Bedrock is designed to avoid the need to open it in the field. SIM cards are accessible from the panel using pin-hole trays. Remote power button connector is conveniently located on the top panel. All brackets and mounting fixtures are assembled from the outside. Should the need arise to open Bedrock (e.g. to install a storage device or replace the RTC battery) Bedrock opens by unscrewing a single screw.

The 0.6 liter Bedrock Tile

When integrating an IPC in tight space convection cooling becomes ineffective and is better replaced with conduction cooling. It is also desirable to make the IPC as compact and thin as possible.

Bedrock Tile is designed for these use cases. The ribbed chassis walls are replaced with flat walls with blind threadings for fastening Bedrock Tile to a cold plate.

A key feature of Bedrock Tile is that it preserves the 360º internal heat distribution so it can be cooled from either side. With thickness of just 29mm and volume of 0.6 liter, Bedrock Tile is easy to integrate in tight spaces. Having all connectors on one side further simplifies the integration.

Advanced integration using Deck

Some integration scenarios call for custom enclosures (e.g. when additional devices must be installed with the computer in the same housing). To support these use cases Bedrock introduces the Deck concept (deck-of-cards).

The SoM, NIO, SX and PM are rigidly held together with fasteners independently of the Bedrock enclosure. The Deck provides first stage cooling for most devices, in particular it includes a copper heat-plate on the CPU. The Deck is fastened to the custom chassis with only 3 screws. Fastening provides thermal coupling to the CPU, RAM, NVMe and FETs. The DC input connector is on wires and can be relocated in the chassis.

Designing with Bedrock SoM

Bedrock SoM makes a convenient and flexible building block for board designers. For many developers, using a SoM would be the only way to develop a computer based on AMD Ryzen™ Embedded V3000. Bedrock SoM makes an attractive platform for that purpose for several reasons.

The SoM is far more self-contained than traditional SoMs. It has not only the essential CPU and RAM, but also NVMe, direct DC input with 12V – 19V tolerance and RTC battery.

The SoM is provided in a ruggedized metal skirt that protects the SoM, provides mounting fixture for extension cards and serves as a heat-spreader for secondary heat sources. Copper heat-plate is pre-assembled on the CPU.​

Customers wishing to develop with Bedrock SoM are welcome to  contact StartIT Kft.

Technikai dokumentáció

The technical documentation is available online at the Atlassian website. You can visit the documents by clicking on the button nearby.

Visit document

 FEATURE SPECIFICATION NOTES
CPU MD Ryzen™ Embedded V3000 Series
8C/16T Zen3+ 6nm
3.8 GHz-ig
45W-ig

RAM Quad channel DDR5-4800 up to 64 GB ECC / non-ECC
2x SODIMM
RAM is conduction cooled
Main storage NVMe PCIe Gen4 x 4
M.2 key-M 2280
Optional power-loss-protection
NVMe is conduction cooled
Extra storages 2x NVMe PCIe Gen4 x 4 2x M.2 key-M 2280
NVMe devices are conduction cooled
LAN 2x 10 GbE (native, supports fiber / copper)
4x 2.5 GbE (Intel I226)
2x SFP+
4x RJ45
WLAN WiFi 6E (Intel AX210)
BT 5.3
2x RP-SMA antennas
Optional and upgradable (M.2 key-E 2230)
Modem 4G / 5G (Quectel) 2x SMA antennas
Optional and upgradable (M.2 key-B 3042 / 3052)
USB 3x USB 3.2 gen 2 10 Gb/s
1x USB 2.0
Connectors:
4x USB type-A
Remote consol Serial over USB mini-USB connector
BIOS AMI Aptio V Dual SPI FLASH for redundancy
Console redirection
Operating system Windows 10/11/IoT, Linux Other x86 operating systems supported
Power DC 12V-60V Phoenix terminal
Other DC connectors available
Temperature range 0ºC to 70ºC -40ºC to 85ºC to be available in 2023
Enclosure All aluminum enclosure, fanless cooling Bedrock V3000 Basic 60W Version
Bedrock V3000 Basic 30W Version
Dimension 30W model:
45 mm (W) x 160 mm (H) x 130 mm (D) – 0.9 liter
60W model:
73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter

Tile model:
29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter
Mounting DIN-rail, wall, table top


In case of B2B we need the company name and VAT number to give an offer. Please register your company, thank you!
In case of B2B we need the company name and VAT number to give an offer. Please register your company, thank you!
Please describe your project.
Please describe the most important requirements you need to satisfy.
In case of the CPU is the 45W V3C48, you need the 60W or Tile. In case of the CPU is the 15W V318I, you need the 30W or tile.
If you have other requests, please let us know. You can check the technical documentation and specification.
Protected by reCAPTCHA, Privacy Policy & Terms of Service apply.
Separate email addresses with a comma.
Send

Fits for industry

Subscribe Köszönettel
Protected by reCAPTCHA, Privacy Policy & Terms of Service apply.

Founded in 2008, working with passive cooling mini PCs since 2009. We distribute, support end users, system integrators, machine constructors.
Data logging, HMI, automation, softPLC systems, supporting windows and linux based solutions.

StartIT Kft.
2600 Vác
Keszeg utca 38.
Magyarország
HU VAT: 14310371-2-13
EU VAT: HU14310371

 +36 20 4489 581

 info@mini-pc.eu

Kövess minket


  • Attention!
  • We only can give official offer for registered users, please register your company, thank you!

    The prices are for quick and dirty information only, the real prices could differs, depending on the HUF/USD rates, actual stock and factory changes.
    You can always accept/refuse the offer during the RFQ.

Copyright © StartIT Kft. 2008 - 2025
English (US) Magyar